Apple is partnering with Broadcom to develop a cutting-edge AI server chip, codenamed Baltra, for its growing Apple Intelligence platform.
This sophisticated chip, slated for a 2026 release, is designed to handle the demanding computational needs of advanced AI features.
Leveraging TSMC's advanced 3nm manufacturing process, Baltra promises to significantly enhance the performance of Apple's AI services.
This collaboration underscores Apple's commitment to developing its own AI infrastructure and bringing improved AI experiences to its users.
