Apple and Broadcom are secretly collaborating on a powerful new AI server chip, codenamed Baltra, designed to significantly boost Apple's AI capabilities.
This advanced chip, expected to launch by 2026, will handle the intense processing demands of increasingly complex AI features.
Manufactured by TSMC using cutting-edge 3nm technology, Baltra aims to support the rapidly growing Apple Intelligence ecosystem.
The collaboration marks another step in Apple's ambitious plan to build its own cloud infrastructure and integrate advanced AI directly into its products.
